The Advanced Semiconductor Joint Labs will develop and advance semiconductor technologies for future electronics markets. The industry partners involved in this international collaboration are: Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron and Tokyo Ohka Kogyo.
The four joint labs in lithography, wafer level packaging (WLP), metrology and assembly, will provide an integrated platform for semiconductor R&D, starting with patterning*, further development of 3D integrated circuits (ICs)**, quality control, and finally, the assembly and high-volume manufacturing of chips.
The four joint labs in lithography, wafer level packaging (WLP), metrology and assembly, will provide an integrated platform for semiconductor R&D, starting with patterning*, further development of 3D integrated circuits (ICs)**, quality control, and finally, the assembly and high-volume manufacturing of chips.
The joint labs build upon the successful model followed by the IME-Applied Materials Centre of Excellence. Together, the four labs will enable the development of innovative semiconductor technologies and allow partners to undertake solutions-oriented semiconductor R&D and facilitate commercialisation that is earlier, faster and cheaper. This international partnership also bears testament to the industry relevance of IME’s deep research capabilities.
Lim Chuan Poh, Chairman of A*STAR said, “The launch of the Advanced Semiconductor Joint Labs reaffirms A*STAR’s deep capabilities and strong infrastructure in the R&D ecosystem to serve the growing needs of the semiconductor industry.”
Professor Dim-Lee Kwong, Executive Director of IME said, “These joint labs further demonstrate our ability to build a global network of partnerships that stretch across the supply chain. These collaborations will encourage semiconductor R&D that is relevant for industry, and provide solutions for a rapidly evolving global electronics market. Through this integrated platform, our partners can leverage A*STAR IME’s technologies and expertise to develop innovative technologies and products to address challenges in the semiconductor industry.”
Speaking at the launch, S Iswaran, Minister, Prime Minister's Office, Second Minister for Home Affairs and Second Minister for Trade & Industry said employment in the semiconductor industry has more than doubled over the past two decades, from about 15,000 in 1993 to 41,000 in 2013. "Over the same period, the industry’s value-added (VA) has grown more than nine-fold, to reach S$10.9 billion in 2013. Reflecting the maturity of our semiconductor industry, VA in the last five years has steadied, at a CAGR of 5.9%," he said.
Iswaran noted that more than half of the world’s semiconductor companies have R&D and manufacturing activities in Singapore today, making the semiconductor industry in Singapore the second largest in the Asia Pacific region, manufacturing one in 10 of the world’s integrated circuits***.
Iswaran noted that more than half of the world’s semiconductor companies have R&D and manufacturing activities in Singapore today, making the semiconductor industry in Singapore the second largest in the Asia Pacific region, manufacturing one in 10 of the world’s integrated circuits***.
With rising affluence in Asia, demand for mobile devices such as smartphones and tablets will continue to grow. This growth in demand, which will drive the production of chips, means that the prospects for the semiconductor sector are bright. According to the World Semiconductor Trade Statistics (WSTS), the semiconductor industry will grow by 6.5% worldwide, and more strongly at 9.3 per cent in the Asia Pacific region, from 2013 to 2014.
Iswaran noted that VA per semiconductor worker in the past five years has grown at a CAGR of 7.3%, double that of the manufacturing industry average, to reach S$270,000 per worker.
Iswaran also disclosed that KLA-Tencor Southeast Asia, a specialist in semiconductor process control solutions and one of the Joint Labs partners, has seen a four-fold increase since 2008 in staff headcount, to approximately 600 employees today. "To tap on the regional and global growth opportunities, KLA-Tencor will be bringing the R&D activities for two of its product lines to Singapore, and plans to hire 20 additional R&D engineers by the end of this year," he said.
Iswaran noted that VA per semiconductor worker in the past five years has grown at a CAGR of 7.3%, double that of the manufacturing industry average, to reach S$270,000 per worker.
Iswaran also disclosed that KLA-Tencor Southeast Asia, a specialist in semiconductor process control solutions and one of the Joint Labs partners, has seen a four-fold increase since 2008 in staff headcount, to approximately 600 employees today. "To tap on the regional and global growth opportunities, KLA-Tencor will be bringing the R&D activities for two of its product lines to Singapore, and plans to hire 20 additional R&D engineers by the end of this year," he said.
"Another IME Joint Labs partner is Tokyo Electron Ltd (TEL), which will be expanding its presence in Singapore from the current sales and support functions to include R&D. The collaboration with IME is expected to create high value R&D jobs and enhance growth opportunities for the industry. TEL will be sharing expertise and knowledge from its Japanese headquarters with its Singapore operations to catalyse the deepening of their research capabilities in Singapore."
Said Kazuo Ushida, President and Representative Director, Nikon Corporation:
"Through this collaboration with A*STAR IME, Nikon will gain knowledge of future process technology and total solutions, which will be important for our lithography system development. We are very excited to partner with one of the most advanced and established institutes in the Asia region.”
Added Katsuhiko Omoto, President, Panasonic Factory Solutions Co.:
“Panasonic Factory Solutions Co., Ltd. is continually conducting extensive research to develop and create technologies that can help its customers to achieve competitive edge in productivity and create value added solutions to their customers. We are confident that the strategic alliance with A*STAR and Joint-Lab members will result in the development of advanced flip chip bonding technologies that will support next generation's semiconductor packaging.”
"Through this collaboration with A*STAR IME, Nikon will gain knowledge of future process technology and total solutions, which will be important for our lithography system development. We are very excited to partner with one of the most advanced and established institutes in the Asia region.”
Added Katsuhiko Omoto, President, Panasonic Factory Solutions Co.:
“Panasonic Factory Solutions Co., Ltd. is continually conducting extensive research to develop and create technologies that can help its customers to achieve competitive edge in productivity and create value added solutions to their customers. We are confident that the strategic alliance with A*STAR and Joint-Lab members will result in the development of advanced flip chip bonding technologies that will support next generation's semiconductor packaging.”
*In semiconductor manufacturing, lithography is the patterning of microchips, and is considered a critical first step in ensuring chips are patterned robustly.
**In 3D chip packaging, multiple chips can be stacked on top of each other and connected with wiring that runs vertically through the stack (called through-silicon vias or TSVs). This reduces package size, decreases power consumption and increases data bandwidth.
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