IGSS GaN (IGaN) and SilTerra Malaysia are pleased to announce have entered into an exclusive technology transfer partnership designed to significantly reduce production costs for high-volume manufacturing focused on gallium nitride on silicon technologies (GaN-on-Si).
IGaN is a Singapore-based global technology developer in GaN-on-Si, while SilTerra is a home-grown Malaysian semiconductor wafer foundry. GaN-on-Si can minimise power conversion losses and can favourably impact the bottom line and long-term business competitiveness of power as well as radio frequency semiconductor companies, both companies said.
GaN devices, used for high power density, wireless power transfer
applications, allow for higher server power, and is designed for
wireless charging applications far beyond low power applications such as
cell phones and laptops. The technology additionally enables greater
energy savings and increased power density in data centres,
significantly reducing operating and capital expenditures in areas of
energy consumption.
“IGaN aims to offer an innovative one-stop solution. This exclusive collaboration, enables customers in power semiconductor to leapfrog into GaN technology devices, unlocking access to the huge opportunity of a US$12 billion power device market,” said Raj Kumar, Chairman and CEO of IGaN.
“We are already engaged in positive discussions with other customers enthusiastic about the potential of our platform, particularly those in the power, radio frequency and sensors market, all of whom are keen to accelerate their access into the rapidly growing GaN market.”
“SilTerra’s achievement in delivering a process that allows for reduced costs represents our partnership’s commitment to achieving the best yielding process and capacity assurance to fulfil our customers’ business expectations. SilTerra also looks to leading the charge in pioneering solutions for the broader semiconductor space in Malaysia,” said Firdaus Abdullah, CEO of SilTerra.
The partnership will see mass production of the new technology in early
2019 and grow employment opportunities covering manufacturing process
integration, and equipment engineering.
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