Iceotope achieves chip cooling industry milestone at 1,000 W

The compute densities required for AI, the overall rising thermal design power of IT equipment, and the need for sustainable cooling solutions have led to a need for cooling solutions for data centres. Iceotope has announced a technology milestone for chip-level cooling with precision liquid cooling. The published results in Achieving chip cooling at 1000W and beyond with single phase Precision Liquid Cooling validate how single-phase liquid cooling can achieve 1,000 W cooling and the exceptional thermal performance of precision liquid cooling, the company said.

Key findings include:

During the test, the thermal resistance remained almost constant at a given flow rate even though the power was increased from 250 W to 1,000 W. At a flow rate of 7 l/min, Iceotope's copper-pinned KUL SINK achieved a thermal resistance of 0.039 K/W when a 1,000 W heat load was applied to Intel’s Airport Cove thermal test vehicle (TTV), a thermal emulator for the 4th Gen Intel Xeon Scalable processors. This translates to an 11.4% improvement in thermal resistance compared to a like-for-like test of a tank immersion product containing a forced-flow heat sink.

The results demonstrate high confidence that testing at 1500W will yield the same consistency based on the testing of the thermal resistance from 250W to 1000W.

“Iceotope Precision Liquid Cooling technology has achieved an important industry milestone by demonstrating enhanced thermal performance capability compared to other competing liquid cooling technologies,” said Neil Edmunds, VP of Product Management at Iceotope.

“We are confident that future testing of our standard solution at elevated power levels will demonstrate further inherent cooling capability. Iceotope are also continuing to develop new solutions which enable even higher roadmap power levels to be attained in a safe, sustainable and scalable way.”

“The ability to cool 1,000 W silicon is a key milestone in building the runway for silicon with higher thermal design power and enabling efficient data centre and edge cluster solutions of the future,” said Mohan J Kumar, Intel Fellow.