Micron Technology has broken ground on a new high-bandwidth memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.
The new advanced packaging facility will be the first of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in 2027 to meet the demands of AI growth.
“As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly,” said Sanjay Mehrotra, President and CEO of Micron.
“With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.”
Micron’s HBM advanced packaging investment of approximately US$7 B through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. The new roles will include functions such as packaging development, assembly and test operations.
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