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I'M Intelligent Memory's new 256 and 512 Megabit SDRAM for industrial applications |
I'M offers its new SDRAM products in commercial or industrial temperature ranges, and in addition to the standard 54 Pin TSOP-II package for SDRAM, also provides the products in an 8x8mm FBGA package. The pin-outs, timings, and functionalities are JEDEC-compliant.
*FBGA, field-programmable grid array, which refers to a particular type of chip design.
*JEDEC, Joint Electron Device Engineering Council, is a standards body.
*SDRAM, a type of memory chip. The acronym stands for Synchronous Dynamic Random Access Memory.
*TSOP, Thin Small-outline Package, refers to a standard type of packaging for chips.
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