TSHT is the second-largest Chinese provider of IC testing and packaging for semiconductor ICs and components. The acquisition of FCI, a specialist in flip chip bumping and wafer level packaging, adds advanced wafer level packaging technologies to the TSHT portfolio. The combined product lines of TSHT and FCI offer a complete range of semiconductor packaging and turnkey services on a worldwide basis.
Jerry Li, newly appointed General Manager at FCI, said: "I am excited about the opportunities that this will bring to the TSHT; introducing both the FCI Phoenix and Shanghai facilities to the Huatian Group of Companies brings a new complementary set of customers to the company. TSHT sees the value in FCI's technology and the employee expertise, and looks forward to taking our business to the next level."
Jerry Li, newly appointed General Manager at FCI, said: "I am excited about the opportunities that this will bring to the TSHT; introducing both the FCI Phoenix and Shanghai facilities to the Huatian Group of Companies brings a new complementary set of customers to the company. TSHT sees the value in FCI's technology and the employee expertise, and looks forward to taking our business to the next level."
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